In Stock: MacDermid Alpha's Solder Solutions

We're excited to announce that solder solutions from MacDermid Alpha are now available on our website. For over 30 years, Active Components and MacDermid Alpha have partnered to deliver high-quality, reliable, and efficient solder solutions to various industries.

Product Highlights

ALPHA SnCX Plus 07 - Solder Bar

Active Number: P612804

ALPHA SnCX Plus 07 is a no-silver, lead-free alloy suitable for use as a replacement for SnPb, SAC305, and other low-silver SAC alloys in wave solder, selective soldering, lead tinning, and rework processes. 

Key features:

• RELIABILITY - Comparable to silver-bearing alloys (i.e., SAC305) and other enhanced Sn99.3Cu0.7 alloys in thermal fatigue resistance, lap shear, and pin pull performance.
• YIELD - Excellent production yields; outperforms Sn99.3Cu0.7 based materials.
• COPPER EROSION - Low erosion in long, hot exposure soldering process.
• DROSS GENERATION - Lowest in class due to the Vaculoy process in conjunction with the addition of a dross-reducing agent.
• SOLDER FILLET SURFACE - Smooth and bright with no surface crack.

ALPHA OM338PT Solder Paste

Active Number: P612816

ALPHA OM338PT is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-PT’s broad processing window is designed to minimise transition concerns from tin-lead to lead-free solder paste.

Key features:

• Maximises reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.225 mm with 0.100 mm stencil thickness.
• Excellent print consistency with a high process capability index across all board designs.
• Print speeds of up to 150 mm/s, enabling a fast print cycle time and a high throughput.
• Wide reflow profile window with good solderability on various board/component finishes.
• Excellent solder and flux cosmetics after reflow soldering. 

ALPHA NR330 No-clean, VOC-Free Flux

Active Number: P252605

ALPHA NR330 is a VOC-free halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore compliant flux for defect-free soldering. It is formulated with a proprietary mixture of organic activators that deliver excellent wetting and top-side hole fill, even with OSP-coated bare copper boards that have undergone prior thermal excursions.

Key features:

• Bellcore compliant for assemblies requiring this standard.
• VOC-free to help meet air quality regulations.
• Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows.
• •Thermally stable activators provide low solder bridging.
• Reduces the surface tension between the solder mask and solder to provide low solderball frequency.

Explore our full range of solder products!